SnapDragon 865 was launched only a couple of months ago, and reports are coming that Qualcomm started working on SnapDragon 875. Yes, You heard it right, no 865+ this time around.




What have we found:

Reports from 91mobiles suggest that Qualcomm is working on the new and mighty SnapDragon 875 codenamed SM8350 and it will be the first chip to be made on a 5nm architecture. This means it will improve the performance significantly and also come in a small package. The chip is supposed to be manufactured by Taiwan's TSMC.

Even though the email received by 91mobiles does not specify intrinsic details about the new chip but throws light on various aspects of the chip. According to the tip, the SD875 will be based on Kryo 685 CPU on v8 ARM Cortex cores. The new Adreno 660 will be there as the graphics processing unit or GPU, along with Adreno 665 as the video processing unit(VPU) and Adreno 1095 as the display processing unit(DPU). Qualcomm will use mm waves and sub 6GHz bands for 3G, 4G, and 5G modems. For the first time Qualcomm will use the new X60 5Gmodem-RF system in its chip. However, it is still unclear whether the modem will be integrated with the CPU or be an optional one.

Other inclusions in the new chip are the Spectra 580 image processing unit(IPU), external 802.11ax, 2x2 MIMO, Bluetooth Milan. Reports also claim that there will be Quad-channel, package-on-package (PoP) high-speed LPDDR5 SDRAM, and a low-power audio subsystem combined with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec.

When will it be announced?

Qualcomm typically launches its flagship chips in around December during its annual unveiling. But this year it may be late because of the Coronavirus issue. Although we expect Qualcomm to launch the new chip in early 2021.



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